Leidos adds ServiceNow to Alliance Partner Network
(Reston, Va.) December 10, 2021 – Leidos (NYSE:LDOS), a FORTUNE® 500 science and technology leader, today announced the addition of ServiceNow to the Leidos Alliance Partner Network (LAPN). LAPN drives innovation through a vast network of the world’s leading technology companies and leverages its supplier base to solve customer problems.
“By adding ServiceNow to the Leidos Alliance Partner Network we’re expanding our offerings and broadening our next-generation solutions for our customers,” said Leidos Chief Procurement Officer Bob Gemmill. “Our relationship with the company is essential to delivering mission success. Together we can secure the latest tools while providing agile workflows to stay ahead of the curve and ensure success.”
“We’re enthusiastic about joining the ‘Leidos Alliance Partner Network’. Leidos’ leadership in digital acceleration at the mission level, provides mission resiliency to our mutual customers.” said Laura Fritzlen, Director of ServiceNow’s Federal Alliances. “Together we have a tremendous opportunity to deliver world class innovation across the government.”
Through this new partnership, ServiceNow will expand their offerings across the commercial and federal markets. The LAPN consists of three partner levels: corporate strategic, technology alliance and emerging technology. ServiceNow will be a Technology Alliance Partner, as the company has the capabilities that work well within Leidos’ framework and is a close ally with innovative technologies and recognized expertise.
Leidos is a Fortune 500® technology, engineering, and science solutions and services leader working to solve the world's toughest challenges in the defense, intelligence, civil, and health markets. The company's 43,000 employees support vital missions for government and commercial customers. Headquartered in Reston, Va., Leidos reported annual revenues of approximately $12.30 billion for the fiscal year ended January 1, 2021. For more information, visit www.Leidos.com.